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TMM6 Microwave Printed Circuit Board 50mil 1.27mm Rogers High Frequency PCB DK 6.0 With Immersion Gold

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TMM6 Microwave Printed Circuit Board 50mil 1.27mm Rogers High Frequency PCB DK 6.0 With Immersion Gold

Brand Name : Bicheng

Model Number : BIC-158.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : Woven Fiberglass Reinforced, Ceramic filled, PTFE based CompositeTMM6 1.270mm

Layer count : 2 layers

PCB thickness : 1.4mm ±0.1

PCB size : 117 x 88mm=1up

Solder mask : Green

Silkscreen : White

Copper weight : 1oz

Surface finish : Immersion gold

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TMM6 Microwave Printed Circuit Board 50mil 1.27mm Rogers High Frequency PCB DK 6.0 With Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General Description

This type of high frequency PCB is built on 50mil TMM6 substrate of which dielectric constant(DK) is 6.0 in process. It is a double layer circuit board with 1oz copper and immersion gold on pad. Via holes with 0.3mm size are filled by resin and capped by copper. Boards are covered with green solder mask and manufactured as per IPC class II standard. Every 25 boards are vacuum-packed for shipment.

PCB Specifications

PCB SIZE 117 x 88mm=1up
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 17um(0.5 oz)+plate TOP layer
TMM6 1.270mm
copper ------- 17um(0.5 oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.30 mm / 2.0 mm
Number of Different Holes: 5
Number of Drill Holes: 2500
Number of Milled Slots: 2
Number of Internal Cutouts: no
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: TMM6 1.270mm
Final foil external: 1.0 oz
Final foil internal: N/A
Final height of PCB: 1.4mm ±0.1
PLATING AND COATING
Surface Finish Immersion gold, 59%
Solder Mask Apply To: Top Layer and Bottom Layer
Solder Mask Color: Green
Solder Mask Type: LPI
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend Component Side
Colour of Component Legend White
Manufacturer Name or Logo: Kuangshun
VIA Plated through hole(PTH), minimum size 0.30mm.
FLAMIBILITY RATING 94V-0
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Typical Applications:

1. Chip testers

2. Dielectric polarizers and lenses

3. Filters and coupler

4. Global Positioning Systems Antennas

5. Patch Antennas

6. Power amplifiers and combiners

7. RF and microwave circuitry

8. Satellite communication systems

Our PCB Capability(TMM6)

PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM6
Dielectric constant: 6
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc..

Data Sheet of TMM6

Property TMM6 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.0±0.08 Z 10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 6.3 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.0023 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant -11 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 2 x 10^8 - Mohm.cm - ASTM D257
Surface Resistivity 1 x 10^9 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 362 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - x 18 X ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 18 Y ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 26 Z ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.72 Z W/m/K 80 ℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.7 (1.0) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 15.02 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.75 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.06 - % D/24/23 ASTM D570
3.18mm (0.125") 0.2
Specific Gravity 2.37 - - A ASTM D792
Specific Heat Capacity 0.78 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

TMM6 Microwave Printed Circuit Board 50mil 1.27mm Rogers High Frequency PCB DK 6.0 With Immersion Gold


Product Tags:

1.27mm Multilayer Pcb Board

      

50mil Multilayer Pcb Board

      

Fiberglass Reinforced Multilayer Pcb Board

      
Wholesale TMM6 Microwave Printed Circuit Board 50mil 1.27mm Rogers High Frequency PCB DK 6.0 With Immersion Gold from china suppliers

TMM6 Microwave Printed Circuit Board 50mil 1.27mm Rogers High Frequency PCB DK 6.0 With Immersion Gold Images

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