Sign In | Join Free | My chinalane.org
China Bicheng Electronics Technology Co., Ltd logo
Bicheng Electronics Technology Co., Ltd
We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
Verified Supplier

5 Years
Home > Rogers PCB Board >

TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold.

Product Categories
Bicheng Electronics Technology Co., Ltd
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold.

  • 1
  • 2
  • 3

Brand Name : Bicheng

Model Number : BIC-156.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : TMM3 0.508mm

Layer count : 2 layers

PCB thickness : 0.68 mm ±0.1

PCB size : 35 x 51mm=1up

Solder mask : Green

Copper weight : 1oz

Surface finish : Immersion gold

Contact Now

TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold.

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General Description

This is a type of double layer high frequency PCB which is built on 20mil TMM3 substrate. It’s with immersion gold, 1oz copper(finished). Green solder mask is printed on top layer and bottom layer is open to air. This mini PCB is manufactured as per IPC class 3, every 50 boards are packed for shipment. It’s for the application of patch antennas.

PCB Specifications

PCB SIZE 35 x 51mm=1up
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 17um(0.5 oz)+plate TOP layer
TMM3 0.508mm
copper ------- 17um(0.5 oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 5 mil / 5 mil
Minimum / Maximum Holes: 0.40 mm / 2.50 mm
Number of Different Holes: 3
Number of Drill Holes: 3
Number of Milled Slots: 0
Number of Internal Cutouts: no
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: TMM3 0.508mm
Final foil external: 1.0 oz
Final foil internal: N/A
Final height of PCB: 0.68 mm ±0.1
PLATING AND COATING
Surface Finish Immersion gold, 99%
Solder Mask Apply To: Top Layer
Solder Mask Color: Green
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.40mm.
FLAMIBILITY RATING 94V-0
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Typical Applications

1. Chip testers

2. Dielectric polarizers and lenses

3. Filters and coupler

4. Global Positioning Systems Antennas

5. Patch Antennas

6. Power amplifiers and combiners

7. RF and microwave circuitry

8. Satellite communication systems

Our PCB Capability(TMM3)

PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM3
Dielectric constant: 3.27
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc..

Data Sheet of TMM3

Property TMM3 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.27±0.032 Z 10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 3.45 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.002 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant +37 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 2 x 109 - Mohm.cm - ASTM D257
Surface Resistivity >9x 10^9 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 441 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - x 15 X ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 15 Y ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 23 Z ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.7 Z W/m/K 80 ℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.7 (1.0) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 16.53 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.72 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.06 - % D/24/23 ASTM D570
3.18mm (0.125") 0.12
Specific Gravity 1.78 - - A ASTM D792
Specific Heat Capacity 0.87 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold.


Product Tags:

0.762mm Microwave Circuit Board

      

30mil Microwave Circuit Board

      

Rogers Immersion Gold Microwave Circuit Board

      
Wholesale TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold. from china suppliers

TMM3 High Frequency Printed Circuit Board 20mil 0.508mm Microwave PCB DK3.27 With Immersion Gold. Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Bicheng Electronics Technology Co., Ltd
*Subject:
*Message:
Characters Remaining: (0/3000)
 
You May Like