Rogers 4003 60mil 1.524mm Circuit Board RO4003C High Frequency PCB Double Sided RF PCB for WLAN
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Hydrocarbon ceramic laminates made of RO4003C are intended to provide excellent high frequency performance and inexpensive circuit construction. Once working frequencies reach 500 MHz and beyond, designers have a much smaller number of laminates to choose from. Designers of RF microwave circuits, matching networks, and controlled impedance transmission lines can rely on the features of RO4003C material. Higher operating frequencies prevent the use of standard circuit board materials in many applications, while low dielectric loss enables RO4003C material to be employed in those applications.
The temperature coefficient of dielectric constant is among the lowest of any circuit board material, and the dielectric constant is stable over a broad frequency range. RO4003C material's thermal coefficient of expansion(CTE) provides several key benefits to the PCB designers. The expansion coefficient of RO4003C is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of RO4003C provides reliable plated through-hole quality, even in severe thermal shock applications. RO4003C material has a Tg of >280C so its expansion characteristics remain stable over the entire range of PCB processing temperatures.
PCB Specifications
| PCB SIZE | 84 x 78mm=1PCS |
| BOARD TYPE | RF PCB, Microwave PCB |
| Number of Layers | Double sided PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um(1oz)+PLATE |
| RO4003C 60mil |
| copper ------- 35um(1oz)+PLATE |
| TECHNOLOGY | |
| Minimum Trace and Space: | 10mil/12mil |
| Minimum / Maximum Holes: | 0.3/2.3mm |
| Number of Different Holes: | 4 |
| Number of Drill Holes: | 155 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | NO |
| BOARD MATERIAL | |
| Glass Epoxy: | RO4003C 60mil, Tg 288℃ |
| Final foil external: | 1.5oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Electroless nickel over Immersion Gold (ENIG)( 2 µ" over 100 µ" nickel) |
| Solder Mask Apply To: | no Solder mask reqruied |
| Solder Mask Color: | no solder mask required |
| Solder Mask Type: | no solder mask reqruied |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | no silkscreen required |
| Colour of Component Legend | no silkscreen required |
| Manufacturer Name or Logo: | no silkscreen required |
| VIA | Plated Through Hole(PTH) |
| FLAMIBILITY RATING | N/A |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Typical applications are automotive radar and sensors, cellular base station antennas, direct broadcast satellites and low noise block etc.
Data Sheet of Rogers 4003C (RO4003C)
| RO4003C Typical Value |
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.55 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0027
0.0021 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 4.2 x 109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850)
19,450(2,821) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2)
100(14.5) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276
(40) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.3 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11
14
46 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 425 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.71 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.79 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 1.05
(6.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | N/A | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
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Rogers PCB 60mil 1.524mm RO4003C Double Sided RF PCB for WLAN Images
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